Job Duties

• Analyze competitive market strategies for PCBA and electronic industries through analysis of related product, market, or share trends.
• Synthesize current business intelligence or trend data to support recommendations for action.
• Collect business intelligence data from electronics industry reports, public information, field reports, or purchased sources.
• Apply business and management principles involved in strategic planning, resource allocation, human resources modeling, leadership technique, production methods, and coordination of people and resources.
• Manage the timely flow of business information to users.
• Identify or monitor current and potential customers, using business intelligence tools.
• Maintain or update business intelligence tools, databases, dashboards, systems, or methods.
• Analyze electronics and technology trends to identify markets for future product development or to improve sales of existing products.
• Prepare analytical reports and update computer database information.
• Implement new data analysis methodologies for the printed circuit board business process.
• Review customer files to ensure integrity of data collection and utilization.
• Plan studies of work problems and procedures, such as organizational change, communications, information flow, integrated production methods, inventory control, or cost analysis.
• Analyze and interpret data from a variety of sources to communicate the progress and outcomes of programs to staff and leadership, to help understand what works and where the gaps are.
• Develop strategies and processes for accomplishing data needs, analytic projects, and the evaluation of programs.
• Develop reports using business intelligence tools, adhering to established frameworks and standards.
• Critically evaluate information from multiple sources and implement data management and business intelligence practices that streamline information delivery.
• Act as a change agent to promote the definition and implementation of strategic, data-driven roadmaps.
• Monitor tools and infrastructure to ensure the availability and performance of developed reports and dashboards.
• Support application installations and upgrades, and develop documentation and training plans to educate the user community on product enhancements.
• Install and test system updates.

Technology & Skills

Job Duties

• Direct end-to-end PCBA production engineering, applying advanced principles of electrical engineering, signal integrity, and thermal management to optimize SMT/THT/mixed-technology lines for high-density, high-reliability assemblies (BGA, QFN, fine-pitch and 01005-scale components).
• Design and implement statistical process control (SPC) systems and predictive/preventive maintenance programs using equipment telemetry and SPI/AOI data trending to eliminate unplanned machine downtime and drive Overall Equipment Effectiveness (OEE) above industry benchmark.
• Upgrade and reconfigure existing SMT placement, reflow, and inspection equipment — including nozzle/feeder tooling, vision-system programming, and reflow profile re-engineering — to extend machine capability to fine-pitch, micro-BGA, and other advanced high-technology assembly processes beyond original equipment specification.
• Lead advanced root-cause failure analysis on rejected and field-returned assemblies using cross-sectioning, X-ray inspection, scanning electron microscopy (SEM), and thermal/vibration stress testing; apply Design of Experiments (DOE), 8D, and Fishbone/Ishikawa methodologies to resolve chronic defect modes at the component and process level.
• Engineer and validate automated and manual test strategies (ICT, boundary-scan/JTAG, flying probe, functional test, HALT/HASS, burn-in) for complex mixed-signal and RF assemblies, developing custom test fixtures and firmware/software test scripts as required.
• Apply reliability engineering principles (MTBF/MTTF analysis, Weibull analysis, accelerated life testing) to quantify component and process reliability and to drive design-for-reliability improvements in collaboration with customer engineering teams.
• Evaluate, specify, and qualify emerging manufacturing technologies — including fine-pitch SMT placement, selective and vapor-phase soldering, conformal coating/encapsulation, and automated optical/X-ray inspection systems — leading capital equipment procurement, installation qualification (IQ/OQ/PQ), and process validation to add new high-technology capability to the facility.
• Architect and execute multi-phase facility modernization and capacity-expansion projects, including cleanroom/ESD-controlled area design, equipment layout and material flow optimization, and integration of Industry 4.0/MES data systems for real-time production visibility.
• Perform Design for Manufacturability and Design for Testability (DFM/DFT) analysis on customer PCB designs, providing engineering feedback on layout, component selection, and tolerancing to prevent downstream yield and reliability issues.
• Develop engineering documentation, including process FMEAs, control plans, work instructions, and test specifications, ensuring compliance with IPC-A-610, IPC/WHMA-A-620, J-STD-001, and applicable customer/industry specifications (ISO 9001, AS9100, ITAR where applicable).
• Provide technical leadership and mentorship to production, process, and test engineering staff and technicians; review and approve engineering changes (ECOs/ECNs) affecting manufacturing processes.
• Ensure regulatory and environmental compliance (RoHS, REACH, conflict minerals) across manufacturing processes and materials, and support customer/regulatory audits with technical documentation.
• Manage supplier and incoming-component qualification programs, including component-level failure analysis, counterfeit-avoidance screening, and second-source qualification for critical electronic components.